Interpack 2011

The trade fair Interpack in Düsseldorf, Germany is the most important and successful fair in the field of processes and packaging. Following the complete value added chain processes and machines not only for sweets and bakery are showed. You will find Tecon, as a leading brand for innovative process technology for the biscuit, wafer and cake industry in hall 1, stand C23 / D24.

We are looking forward to meeting you during Interpack 2011, 12. - 18. May, in Düsseldorf. Our plant is only a 30 min. drive away from Düsseldorf. If you would like to visit our operation, please make appointments in time.

www.interpack.de